? 2003 california micro devices corp. all rights reserved. 10/10/03 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 1 CSPESD304 4-channel esd array in csp features ? four channels of esd protection + 15kv esd protection on each channel (iec 61000-4-2 level 4, contact discharge) + 30kv esd protection on each channel (hbm) chip scale package features extremely low lead inductance for optimum esd protection 5-bump, 0.950mm x 1.410mm footprint chip scale package (csp) lead-free version available applications esd protection for sensitive electronic equipment i/o port and keypad and button circuitry protection for portable devices can be used for emi filtering when combined with external series resistance wireless handsets handheld pcs / pdas mp3 players digital camcorders notebooks desktop pcs product description the cspesd 304 is a quad esd transient voltage supression diode array. each diode provides a very high level of protection for sensitive electronic compo- nents that may be subjected to electrostatic discharge (esd). these diodes are designed and characterized to safely dissipate esd strikes of 15kv, exceeding the maximum requirement of the iec 61000-4-2 interna- tional standard. using the mil-std-883 (method 3015) specification for human body model (hbm) esd, the device provides protection for contact discharges to greater than 30kv. the CSPESD304 is particularly well suited for portable electronics (e.g., cellular telephones, pdas, notebook computers) because of its small package format and low weight. the CSPESD304 is available in a space-saving, low- profile chip scale package with optional lead-free fin- ishing. electrical schematic b2 esd_1 gnd c1 c3 a1 a3 esd_2 esd_3 esd_4
? 2003 california micro devices corp. all rights reserved. 2 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 10/10/03 CSPESD304 ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. note 2: lead-free devices are specified by using a " + " character for the top side orientation mark. pin descriptions pin name description a1 esd1 esd channel1 a3 esd2 esd channel 2 b2 gnd device ground c1 esd3 esd channel 3 c3 esd4 esd channel 4 esd_1 esd_2 esd_3 esd_4 a1 a3 c3 c1 gnd b2 orientation marking a1 e 23 1 c b a orientation marking (see note 2) package / pinout diagrams notes: CSPESD304 csp package top view bottom view (bumps down view) (bumps up view) 1) these drawings are not to scale. 2) lead-free devices are specified by using a " + " character for the top side orientation mark. part numbering information bumps package standard finish lead-free finish 2 ordering part number 1 part marking ordering part number 1 part marking 5 csp CSPESD304 e CSPESD304g e
? 2003 california micro devices corp. all rights reserved. 10/10/03 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 3 CSPESD304 specifications note 1: t a =-40 to +85 c unless otherwise specified. note 2: esd applied to input and output pins with respect to gnd, one at a time. note 3: unused pins are left open note 4: these parameters are guaranteed by design and characterization. absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc package power rating 200 mw standard operating conditions parameter rating units operating temperature range -40 to +85 c electrical operating characteristics 1 symbol parameter conditions min typ max units v diode diode reverse breakdown voltage i diode = 10 a5.5 v i leak diode leakage current v in =3.3v, t a =25c 100 na v sig signal voltage positive clamp negative clamp i diode = 10ma 5.6 -0.4 6.8 -0.8 9.0 -1.5 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 notes 2, 3 and 4 + 30 + 15 kv kv v cl clamping voltage during esd discharge mil-std-883 (method 3015), 8kv positive transients negative transients notes 2, 3 and 4 +15 -8 v v c diode diode capacitance at 2.5vdc reverse bias, 1mhz, 30mvac 22 27 32 pf
? 2003 california micro devices corp. all rights reserved. 4 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 10/10/03 CSPESD304 performance information diode characteristics (nominal conditions unless specified otherwise) figure 1. typical diode capacitance vs. input voltage (normalized to 2.5vdc) figure 2. frequency response (single channel vs. gnd, in 50 ? system) capacitance (normalized) dc voltage
? 2003 california micro devices corp. all rights reserved. 10/10/03 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 5 CSPESD304 application information refer to application note ap-217, "the chip scale package", for a detailed description of chip scale packages offered by california micro devices. figure 3. recommended non-solder mask defined pad illustration figure 4. eutectic (snpb) solder ball reflow profile figure 5. lead-free (snagcu) solder ball reflow profile printed circuit board recommendations parameter value pad size on pcb 0.275mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.325mm round solder stencil thickness 0.125 - 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.330mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous 60 seconds soldering maximum temperature 260c solder mask opening 0.325mm dia. non-solder mask defined pad 0.275mm dia. solder stencil opening 0.330mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature (c)
? 2003 california micro devices corp. all rights reserved. 6 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 10/10/03 CSPESD304 mechanical details csp mechanical specifications CSPESD304 devices are packaged in a custom chip scale package (csp). dimensions are presented below. for complete information on csp packaging, see the california micro devices csp package infor- mation document. package dimensions for CSPESD304 chip scale package csp tape and reel specifications figure 6. tape and reel mechanical data package dimensions package custom csp bumps 5 dim millimeters inches min nom max min nom max a1 0.915 0.960 1.005 0.0360 0.0378 0.0396 a2 1.285 1.330 1.375 0.0506 0.0524 0.0541 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.245 0.250 0.255 0.0096 0.0098 0.0100 b3 0.430 0.435 0.440 0.0169 0.0171 0.0173 b4 0.430 0.435 0.440 0.0169 0.0171 0.0173 c1 0.180 0.230 0.280 0.0071 0.0091 0.0110 c2 0.180 0.230 0.280 0.0071 0.0091 0.0110 d1 0.561 0.605 0.649 0.0221 0.0238 0.0255 d2 0.355 0.380 0.405 0.0140 0.0150 0.0159 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams a b c 12 c1 b1 a1 b3 c2 dimensions in millimeters d1 d2 a2 bottom view side view 3 b2 b4 0.30 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 CSPESD304 1.33 x 0.96 x 0.6 1.42 x 1.07 x 0.74 8mm 178mm (7") 3500 4mm 4mm top for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o
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